H-1B Wage Lookup

Data through FY2026 Q3 (Jun 30, 2026)

Qualcomm Technologies, Inc. · Packaging Engineer

Employer and title profile for Qualcomm Technologies, Inc. · Packaging Engineer covers 13 filings across the reporting window. FY2026 certified median offer: $128,898.

FY2026 certified median
$128,898
Total filings
13
Lowest–highest certified offer
$98,500–$156,853
Latest decision date
2026-01-28

All-years certified median $119,434 · Range $98,500 to $156,853

Median offer by fiscal year

Certified median offer, Qualcomm Technologies, Inc. · Packaging EngineerFY2026 (Q1–Q3) $128,898$0$50,000$100,000$150,000FY2026 (Q1–Q3)$128,898Certified median offer, Qualcomm Technologies, Inc. · Packaging EngineerFY2026 (Q1–Q3) $128,898$0$50k$100k$150kFY2026*$128,898
Certified H-1B LCAs, $15k–$2M, DOL OFLC

Latest filings

Latest case decisions
CaseDecisionStatusCityAnnual offer
I-200-26021-5746232026-01-28CertifiedSanta Clara$156,853
I-200-26019-5692402026-01-26CertifiedSan Diego$128,898
I-200-26019-5692442026-01-26CertifiedAustin$110,656
I-200-25070-7659392025-03-18CertifiedSanta Clara$140,805
I-200-25044-6893422025-02-21CertifiedSan Diego$119,434
I-200-25030-6529932025-02-06CertifiedSan Diego$119,434
I-200-25030-6532962025-02-06CertifiedSan Diego$119,434
I-200-25030-6532992025-02-06CertifiedAustin$98,500
I-200-24089-8394312024-04-05CertifiedAustin$109,470
I-200-24070-7859012024-03-15CertifiedSanta Clara$126,984
I-200-24043-7103182024-02-20CertifiedSan Diego$112,882
I-200-24041-7095102024-02-16CertifiedSan Diego$112,882
I-200-24037-6959942024-02-13CertifiedSan Diego$112,882
View title filings