H-1B Wage Lookup

Data through FY2026 Q3 (Jun 30, 2026)

Qualcomm Technologies, Inc. · Senior Packaging Engineer

Employer and title profile for Qualcomm Technologies, Inc. · Senior Packaging Engineer covers 13 filings across the reporting window. FY2026 certified median offer: $128,898.

FY2026 certified median
$128,898
Total filings
13
Lowest–highest certified offer
$115,500–$156,853
Latest decision date
2026-05-04

All-years certified median $127,200 · Range $115,500 to $156,853

Median offer by fiscal year

Certified median offer, Qualcomm Technologies, Inc. · Senior Packaging EngineerFY2026 (Q1–Q3) $128,898$0$50,000$100,000$150,000FY2026 (Q1–Q3)$128,898Certified median offer, Qualcomm Technologies, Inc. · Senior Packaging EngineerFY2026 (Q1–Q3) $128,898$0$50k$100k$150kFY2026*$128,898
Certified H-1B LCAs, $15k–$2M, DOL OFLC

Latest filings

Latest case decisions
CaseDecisionStatusCityAnnual offer
I-200-26117-8411012026-05-04CertifiedIrvine$127,200
I-200-26075-7053862026-03-23CertifiedSan Diego$128,898
I-200-26012-5507982026-01-20CertifiedSan Diego$128,898
I-200-25345-4747952025-12-18CertifiedSan Diego$128,898
I-200-25318-4075522025-11-21CertifiedSan Diego$128,898
I-200-25225-2385852025-08-20CertifiedAustin$127,200
I-200-25225-2395902025-08-20CertifiedSanta Clara$156,853
I-200-25063-7422802025-03-11CertifiedSan Diego$127,200
I-200-25016-6220962025-01-24CertifiedSan Diego$119,434
I-200-24079-8135072024-03-26CertifiedSan Diego$115,500
I-200-24073-7941762024-03-19CertifiedSan Diego$115,500
I-200-23324-5137832023-11-28CertifiedSan Diego$115,500
I-200-23305-4695742023-11-08CertifiedSan Diego$115,500
View title filings