H-1B Wage Lookup

Data through FY2026 Q3 (Jun 30, 2026)

Qualcomm Technologies, Inc. · Senior Staff Packaging Engineer

Employer and title profile for Qualcomm Technologies, Inc. · Senior Staff Packaging Engineer covers 8 filings across the reporting window. FY2025 certified median offer: $180,400.

FY2025 certified median
$180,400
Total filings
8
Lowest–highest certified offer
$162,400–$188,926
Latest decision date
2025-04-01

All-years certified median $174,700 · Range $162,400 to $188,926

Median offer by fiscal year

Certified median offer, Qualcomm Technologies, Inc. · Senior Staff Packaging EngineerFY2025 $180,400$0$70,000$140,000$210,000FY2025$180,400Certified median offer, Qualcomm Technologies, Inc. · Senior Staff Packaging EngineerFY2025 $180,400$0$70k$140k$210kFY2025$180,400
Certified H-1B LCAs, $15k–$2M, DOL OFLC

Latest filings

Latest case decisions
CaseDecisionStatusCityAnnual offer
I-200-25084-8024882025-04-01CertifiedSan Diego$180,400
I-200-25063-7419012025-03-11CertifiedSan Diego$180,400
I-200-25048-6986062025-02-24CertifiedSan Diego$180,400
I-200-25035-6631022025-02-11CertifiedGilbert$162,400
I-200-24327-4932432024-12-02CertifiedSan Diego$169,000
I-200-24144-0308802024-05-31CertifiedSan Diego$169,000
I-200-24055-7460112024-03-01CertifiedSan Diego$169,000
I-200-23268-3792572023-10-02CertifiedSanta Clara$188,926
View title filings