H-1B Wage Lookup

Data through FY2026 Q3 (Jun 30, 2026)

Sandisk Technologies, Inc. · Principal Engineer, Packaging Engineering

Employer and title profile for Sandisk Technologies, Inc. · Principal Engineer, Packaging Engineering covers 10 filings across the reporting window. FY2026 certified median offer: $170,248.

FY2026 certified median
$170,248
Total filings
10
Lowest–highest certified offer
$158,995–$185,869
Latest decision date
2026-04-03

All-years certified median $170,248 · Range $158,995 to $185,869

Median offer by fiscal year

Certified median offer, Sandisk Technologies, Inc. · Principal Engineer, Packaging EngineeringFY2026 (Q1–Q3) $170,248$0$60,000$120,000$180,000FY2026 (Q1–Q3)$170,248Certified median offer, Sandisk Technologies, Inc. · Principal Engineer, Packaging EngineeringFY2026 (Q1–Q3) $170,248$0$60k$120k$180kFY2026*$170,248
Certified H-1B LCAs, $15k–$2M, DOL OFLC

Latest filings

Latest case decisions
CaseDecisionStatusCityAnnual offer
I-200-26087-7376142026-04-03CertifiedMilpitas$158,995
I-200-26087-7376172026-04-03CertifiedSan Jose$158,995
I-200-26076-7090062026-03-24CertifiedMilpitas$176,509
I-200-26076-7090162026-03-24CertifiedSan Jose$176,509
I-200-26075-7059702026-03-23CertifiedFremont$170,248
I-200-26068-6890152026-03-16CertifiedMilpitas$170,248
I-200-25220-2319302025-08-15CertifiedMilpitas$170,248
I-200-25220-2319412025-08-15CertifiedSan Jose$170,248
I-200-25198-1838392025-07-24CertifiedMilpitas$185,869
I-200-25198-1838412025-07-24CertifiedMilpitas$185,869
View title filings