H-1B Wage Lookup

Data through FY2026 Q3 (Jun 30, 2026)

Winbond Electronics Corporation America

Company profile for Winbond Electronics Corporation America covers 4 filings across the reporting window. FY2026 certified median offer: $145,299.

FY2026 certified median
$145,299
Total filings
4
FY2026 25th–75th percentile
$139,521–$151,076
Top job title
Design Engineer
Certified offers by fiscal year
Fiscal yearFilingsMedian25th percentile75th percentile
FY20241$129,730$129,730$129,730
FY20251$151,091$151,091$151,091
FY2026 (Q1–Q3)2$145,299$139,521$151,076

FY2026 is partial (*). Its filing totals are not comparable to a full fiscal year.

Median offer by fiscal year

Certified median offer, Winbond Electronics Corporation AmericaFY2024 $129,730; FY2025 $151,091; FY2026 (Q1–Q3) $145,299$0$60,000$120,000$180,000FY2024$129,730FY2025$151,091FY2026 (Q1–Q3)$145,299Certified median offer, Winbond Electronics Corporation AmericaFY2024 $129,730; FY2025 $151,091; FY2026 (Q1–Q3) $145,299$0$60k$120k$180kFY2024$129,730FY2025$151,091FY2026*$145,299
Certified H-1B LCAs, $15k–$2M, DOL OFLC

Top titles

  1. Design Engineer1 filings
  2. FLASH MEMORY SEGMENT MARKETING MANAGER1 filings
  3. Logic Design Engineer1 filings
  4. SR. FLASH MEMORY SALES ENGINEER1 filings

Top cities

  1. San Jose3 filings
  2. Livonia1 filings

Employer and title details